3D Integration for NoC-based SoC Architectures
This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.Although the actual defect mechanisms might be different, the resulting faults for TSV-based interconnects are rather similar to the faults normally considered for wiring interconnects: opens, shorts, and delay faults. This means there is also aanbsp;...
| Title | : | 3D Integration for NoC-based SoC Architectures |
| Author | : | Abbas Sheibanyrad, Frédéric Pétrot, Axel Jantsch |
| Publisher | : | Springer Science & Business Media - 2010-11-08 |
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