Flip Chip Technologies
'Flip Chip' has come to describe a group of related technologies that are used for connecting a chip to a substrate without the use of wires. Instead of using traditional wire leads, the chip is literally placed upside down, lying directly upon the substrate. This is the first book on this topic, a comprehensive reference that covers the design, engineering, and manufacturing of these packages.4-point Q ol WIT pair (8 pair/chip) * ac * * acacac * vW Substrate Q Temp Sensor Chip Heater 1 ^ I r Al J Figure 13.4 Simplified chip-on-substrate diagram. One must solve the transient heat-transfer problem of the complete structure including heatsinksanbsp;...
| Title | : | Flip Chip Technologies |
| Author | : | John H. Lau |
| Publisher | : | McGraw-Hill Professional Publishing - 1996 |
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